Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability| By: | Tae-Kyu Lee; Thomas R. Bieler; Choong-Un Kim; Hongtao Ma |
| Publisher: | Springer Nature |
| Print ISBN: | 9781461492658 |
| eText ISBN: | 9781461492665 |
| Edition: | 0 |
| Copyright: | 2015 |
| Format: | Page Fidelity |
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Table of Contents
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.