Back to results
Cover image for book Introduction to Microsystem Packaging Technology

Introduction to Microsystem Packaging Technology

By:Yufeng Jin; Zhiping Wang; Jing Chen
Publisher:Taylor & Francis
Print ISBN:9781439819104
eText ISBN:9781351832977
Edition:1
Format:Reflowable

eBook Features

Instant Access

Purchase and read your book immediately

Read Offline

Access your eTextbook anytime and anywhere

Study Tools

Built-in study tools like highlights and more

Read Aloud

Listen and follow along as Bookshelf reads to you