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Cover image for book Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties

By:Michael Pecht; Rakish Agarwal; F. Patrick McCluskey; Terrance J. Dishongh; Sirus Javadpour; Rahul Ma
Publisher:Taylor & Francis
Print ISBN:9780849396250
eText ISBN:9781351830041
Edition:1
Copyright:1998
Format:Reflowable

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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

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