Area Array Packaging Handbook: Manufacturing and Assembly
| By: | Ken Gilleo |
| Publisher: | McGraw-Hill Professional |
| Print ISBN: | 9780071374934 |
| eText ISBN: | 9780071500654 |
| Edition: | 1 |
| Copyright: | 2001 |
| Format: | Page Fidelity |
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Table of Contents
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)*Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)